▒▒▒ Micro materials & joining Laboratory ▒▒


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   An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler
구 분 국제학술전문지(SCI) 게재년월 2014.08
제 목 An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler
비고(게재지 등) Microelectronics Reliability (Vol. 54 No.12 pp. 2944~2950)



    


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