▒▒▒ Micro materials & joining Laboratory ▒▒


 78, 1/1 회원가입  로그인  
   관리자
   Evaluation of the Characteristics of 305SAC Lead-Free Solder Joints between a Chip Electrode and a Cu-Pad in Automotive Electronics
구 분 국제학술전문지(SCIE) 게재년월 2015.11.01
제 목 Evaluation of the Characteristics of 305SAC Lead-Free Solder Joints between a Chip Electrode and a Cu-Pad in Automotive Electronics
비고(게재지 등) International Journal of Precision Engineering and Manufacturing (Vol. 16, No. 12, pp. 2483~2490)



    


Copyright 1999-2018 Zeroboard / skin by kidd^^