▒▒▒ Micro materials & joining Laboratory ▒▒


 79, 1/1 회원가입  로그인  
   관리자
   Degradation Characteristics and Ni3Sn4 IMC Growth by a Thermal Shock Test in SAC305 Solder Joints of MLCCs Applied in Automotive Electronics
구 분 국제학술전문지(SCIE) 게재년월 2016.04
제 목 Degradation Characteristics and Ni3Sn4 IMC Growth by a Thermal Shock Test in SAC305 Solder Joints of MLCCs Applied in Automotive Electronics
비고(게재지 등) International Journal of Precision Engineering and Manufacturing(Vol. 17 No.4 445~452)



    


Copyright 1999-2018 Zeroboard / skin by kidd^^