▒▒▒ Micro materials & joining Laboratory ▒▒


 79, 1/1 회원가입  로그인  
   관리자
   Ball Grid Array Interconnection Properties of Solderable Polymer–Solder Composites With Low-Melting-Point Alloy Fillers
구 분 국제학술전문지(SCIE, TOP 50%) 게재년월 2017.12
제 목 Ball Grid Array Interconnection Properties of Solderable Polymer–Solder Composites With Low-Melting-Point Alloy Fillers
비고(게재지 등) ASME(Vol. 139, 041007-1 ~ 041007-9)



    


Copyright 1999-2018 Zeroboard / skin by kidd^^