▒▒▒ Micro materials & joining Laboratory ▒▒


 78, 1/1 회원가입  로그인  
   관리자
   Stress Analysis and Life Improvement of Solder Joint in TSOP with Claded Die Pad
구 분 국제학술회의 게재년월 1998. 1
제 목 Stress Analysis and Life Improvement of Solder Joint in TSOP with Claded Die Pad
비고(게재지 등) 4th symposium Mate(Vol.  No. 36)



    


Copyright 1999-2018 Zeroboard / skin by kidd^^