▒▒▒ Micro materials & joining Laboratory ▒▒


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   Aging Characteristic and prediction of thermal fatigue life of lead-free BGA solder joints
구 분 국제학술회의 게재년월 2001.11
제 목 Aging Characteristic and prediction of thermal fatigue life of lead-free BGA solder joints
비고(게재지 등) 2001IBSC (Vol. No. 46~54)



    


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