▒▒▒ Micro materials & joining Laboratory ▒▒


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   The Growth Kinetics of Intermetallic Compound Layer at the Interface between Sn-3.5Ag Base Solder and (Cu, Electroless Ni-P/Cu, Immersion Au/Ni-P/Cu) Substrate
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구 분 국제학술회의 게재년월 2002.02
제 목 The Growth Kinetics of Intermetallic Compound Layer at the Interface between Sn-3.5Ag Base Solder and (Cu, Electroless Ni-P/Cu, Immersion Au/Ni-P/Cu) Substrate
비고(게재지 등) mate 2002 8th symposium (Vol. 8 No. 3 351~356)



    


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