▒▒▒ Micro materials & joining Laboratory ▒▒


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   Intermatallic Compound Layer Formation Between Sn-3.5Ag BGA Solder Ball and(Cu, immersion Au/electroless Ni-p/Cu)  Substrate
구 분 국외전문학술지 게재년월 2003.07
제 목 Intermatallic Compound Layer Formation Between Sn-3.5Ag BGA Solder Ball and(Cu, immersion Au/electroless Ni-p/Cu) Substrate
비고(게재지 등) Journal of Materials Science(SCI) (Vol. 14 No. 8 487~493)



    


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