▒▒▒ Micro materials & joining Laboratory ▒▒


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   Reliability Evaluation of QFP Solder Joint Using Sn-8Zn-3Bi Solder Paste during the Thermal Shock Test
구 분 국제학술회의 Proceedings 게재 게재년월 2007.05
제 목 Reliability Evaluation of QFP Solder Joint Using Sn-8Zn-3Bi Solder Paste during the Thermal Shock Test
비고(게재지 등) IWJC(Vol. 580-582 pp. 247-250)



    


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