▒▒▒ Micro materials & joining Laboratory ▒▒


 79, 1/1 회원가입  로그인  
   관리자
   Interfacial reaction and joint reliability of fine-pitch flip-chip solder bump using stencil printing method
구 분 국외학술전문지(SCI) 게재년월 2007.12
제 목 Interfacial reaction and joint reliability of fine-pitch flip-chip solder bump using stencil printing method
비고(게재지 등) Microelectronic Engineering(Vol. 84 pp. 2640~2645)



    


Copyright 1999-2018 Zeroboard / skin by kidd^^