¢Æ¢Æ¢Æ Micro materials & joining Laboratory ¢Æ¢Æ
79,
1/1
°ü¸®ÀÚ
Finite Element Modeling of Ultrasonic Chip on Glass (COG) Bonding with Anisotropic Conductive Films (ACFs)
±¸ ºÐ
±¹Á¦ÇмúȸÀÇ Proceedings °ÔÀç
°ÔÀç³â¿ù
2008.06
Á¦ ¸ñ
Finite Element Modeling of Ultrasonic Chip on Glass (COG) Bonding with Anisotropic Conductive Films (ACFs)
ºñ°í(°ÔÀçÁö µî)
Interfinish2008(p. 371)
Copyright 1999-2019
Zeroboard
/ skin by
kidd^^