▒▒▒ Micro materials & joining Laboratory ▒▒


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   Finite Element Modeling of Ultrasonic Chip on Glass (COG) Bonding with Anisotropic Conductive Films (ACFs)
구 분 국제학술회의 Proceedings 게재 게재년월 2008.06
제 목 Finite Element Modeling of Ultrasonic Chip on Glass (COG) Bonding with Anisotropic Conductive Films (ACFs)
비고(게재지 등) Interfinish2008(p. 371)



    


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