▒▒▒ Micro materials & joining Laboratory ▒▒


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   Characteristics of Sn-2.5Ag Flip Chip Solder Joints under Thermal Shock Test Conditions
구 분 국외학술전문지(SCI) 게재년월 2009.02
제 목 Characteristics of Sn-2.5Ag Flip Chip Solder Joints under Thermal Shock Test Conditions
비고(게재지 등) Journal of Mechanical Science and Technology(Vol. 23 No. 2 435~441)



    


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