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   Characteristics of Thermosonic Anisotropic Conductive Adhesives (ACFs) Flip-Chip Bonding
구 분 국제학술전문지(SCI) 게재년월 2010.10.01
제 목 Characteristics of Thermosonic Anisotropic Conductive Adhesives (ACFs) Flip-Chip Bonding
비고(게재지 등) Materials Transactions (Vol. 51 No. 10 pp. 1790-1795)



    


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