▒▒▒ Micro materials & joining Laboratory ▒▒


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   Reliability of Fine-Pitch Flip-Chip (COG) Bonding with Non-Conductive Film Using Ultrasonic Energy
구 분 국제학술전문지(SCI) 게재년월 2010.06
제 목 Reliability of Fine-Pitch Flip-Chip (COG) Bonding with Non-Conductive Film Using Ultrasonic Energy
비고(게재지 등) The Journal of Adhesion(Vol. 86 No. 5 470~479)



    


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