▒▒▒ Micro materials & joining Laboratory ▒▒


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   Dynamic Filling Characteristic Capillary Driven Underfill Process in Flip-Chip Packaging
구 분 국제학술전문지(SCI) 게재년월 2011.09
제 목 Dynamic Filling Characteristic Capillary Driven Underfill Process in Flip-Chip Packaging
비고(게재지 등) Materials Transactions(Vol. 52 No.10 1998~2003)



    


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