▒▒▒ Micro materials & joining Laboratory ▒▒


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   A Study on The Degradation Characteristics of MLCCs SAC305 Lead-Free Solder Joints and Growth IMCs by Thermal Shock Test
구 분 국내전문학술지 기 간 2016.03.01
제 목 A Study on The Degradation Characteristics of MLCCs SAC305 Lead-Free Solder Joints and Growth IMCs by Thermal Shock Test
비고(게재지 등) 전기전자재료학회 (Vol. 29 No. 3 pp. 152-158)



    


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