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A Study on The Degradation Characteristics of MLCCs SAC305 Lead-Free Solder Joints and Growth IMCs by Thermal Shock Test

구 분	국내전문학술지	기 간	2016.03.01
제 목	A Study on The Degradation Characteristics of MLCCs SAC305 Lead-Free Solder Joints and Growth IMCs by Thermal Shock Test
비고(게재지 등)	전기전자재료학회 (Vol. 29 No. 3 pp. 152-158)