▒▒▒ Micro materials & joining Laboratory ▒▒
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관리자
Sn-3.5Ag-0.7Cu Micro-BGA의 Soldering성 연구
구 분
국내전문학술지
기 간
2000. 7
제 목
Sn-3.5Ag-0.7Cu Micro-BGA의 Soldering성 연구
비고(게재지 등)
Journal of the Microeletronics & Package Technology (Vol. 7 No. 3 55～61)
Copyright 1999-2019
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