▒▒▒ Micro materials & joining Laboratory ▒▒
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관리자
스탬핑 리드프레임의 버와 잔류응력 제거를 위한 전해연마의 적용
구 분
국내전문학술지
기 간
2001.09
제 목
스탬핑 리드프레임의 버와 잔류응력 제거를 위한 전해연마의 적용
비고(게재지 등)
Journal of the Microeletronics & Package Technology (Vol. 8 No. 3 19～24)
Copyright 1999-2019
Zeroboard
/ skin by
kidd^^
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