▒▒▒ Micro materials & joining Laboratory ▒▒
<p align="right"><object classid="clsid:D27CDB6E-AE6D-11cf-96B8-444553540000" codebase="http://download.macromedia.com/pub/shockwave/cabs/flash/swflash.cab#version=6,0,29,0" width="700" height="45"> <param name="movie" value="../images/연구실메뉴.swf"> <param name="play" value="true"> <param name="loop" value="true"> <param name="quality" value="high"> <embed width="700" height="45" src="../images/연구실메뉴.swf" play="true" loop="true" quality="high" pluginspage="http://www.macromedia.com/shockwave/download/index.cgi?P1_Prod_Version=ShockwaveFlash"></embed></object></p>
<object classid="clsid:D27CDB6E-AE6D-11cf-96B8-444553540000" codebase="http://download.macromedia.com/pub/shockwave/cabs/flash/swflash.cab#version=6,0,29,0" width="950" height="150"> <param name="movie" value="../images/sub.swf"> <param name="play" value="true"> <param name="loop" value="true"> <param name="quality" value="high"> <embed width="950" height="150" src="../images/sub.swf" play="true" loop="true" quality="high" pluginspage="http://www.macromedia.com/shockwave/download/index.cgi?P1_Prod_Version=ShockwaveFlash"></embed></object>
108,
1/1
관리자
가속화 시험을 통한 플립칩 패키지의 열적.기계적 신뢰성 평가
구 분
국내학술회의
기 간
2006.05
제 목
가속화 시험을 통한 플립칩 패키지의 열적.기계적 신뢰성 평가
비고(게재지 등)
대한용접학회 춘계학술대회
Copyright 1999-2020
Zeroboard
/ skin by
kidd^^
108, 
1/1 
