▒▒▒ Micro materials & joining Laboratory ▒▒
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관리자
가속화 시험을 통한 플립칩 패키지의 열적.기계적 신뢰성 평가
구 분
국내학술회의
기 간
2006.05
제 목
가속화 시험을 통한 플립칩 패키지의 열적.기계적 신뢰성 평가
비고(게재지 등)
대한용접학회 춘계학술대회
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