▒▒▒ Micro materials & joining Laboratory ▒▒
<p align="right"><object classid="clsid:D27CDB6E-AE6D-11cf-96B8-444553540000" codebase="http://download.macromedia.com/pub/shockwave/cabs/flash/swflash.cab#version=6,0,29,0" width="700" height="45"> <param name="movie" value="../images/연구실메뉴.swf"> <param name="play" value="true"> <param name="loop" value="true"> <param name="quality" value="high"> <embed width="700" height="45" src="../images/연구실메뉴.swf" play="true" loop="true" quality="high" pluginspage="http://www.macromedia.com/shockwave/download/index.cgi?P1_Prod_Version=ShockwaveFlash"></embed></object></p>
<object classid="clsid:D27CDB6E-AE6D-11cf-96B8-444553540000" codebase="http://download.macromedia.com/pub/shockwave/cabs/flash/swflash.cab#version=6,0,29,0" width="950" height="150"> <param name="movie" value="../images/sub.swf"> <param name="play" value="true"> <param name="loop" value="true"> <param name="quality" value="high"> <embed width="950" height="150" src="../images/sub.swf" play="true" loop="true" quality="high" pluginspage="http://www.macromedia.com/shockwave/download/index.cgi?P1_Prod_Version=ShockwaveFlash"></embed></object>
108,
1/1
관리자
3D 패키지용 관통 전극 형성에 관한 연구
구 분
국내전문학술지
기 간
2006.04
제 목
3D 패키지용 관통 전극 형성에 관한 연구
비고(게재지 등)
대한용접학회(Vol.24 No.2 64-70)
Copyright 1999-2019
Zeroboard
/ skin by
kidd^^
108, 
1/1 
