▒▒▒ Micro materials & joining Laboratory ▒▒


 78, 1/1 회원가입  로그인  
78    Ball Grid Array Interconnection Properties of Solderable Polymer–Solder Composites With Low-Melting-Point Alloy Fillers    관리자    2017/12/07  128
77    Comparison of the 60Sn40Pb and 62Sn2Ag36Pb Solders for a PV Ribbon Joint in Photovoltaic Modules Using the Thermal Shock Test    관리자    2017/04/21  1396
76    Degradation Characteristics and Ni3Sn4 IMC Growth by a Thermal Shock Test in SAC305 Solder Joints of MLCCs Applied in Automotive Electronics    관리자    2016/04/03  1807
75    Evaluation of the Characteristics of 305SAC Lead-Free Solder Joints between a Chip Electrode and a Cu-Pad in Automotive Electronics    관리자    2015/11/06  649
74    Research on the Power Drop of Photovoltaic Module’s Aging Through the Thermal Shock Test    관리자    2015/11/06  635
73    Fabrication of SiCp/2024 Composite Alloys Using Friction Stir Welding and Its Mechanical Properties    관리자    2015/07/20  797
72    Bonding Characteristics of Underfilled Ball Grid Array Packaging    관리자    2015/07/14  711
71    An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler    관리자    2015/01/12  628
70    Dynamic behavior of capillary-driven encapsulation flow characteristics for different injection types in flip chip packaging    관리자    2014/02/21  787
69    Study of Characteristics of Solar Cells through Thermal Shock and High-Temperature and High-Humidity Testing    관리자    2014/02/14  763
68    Characterization of Ag-Pd Nanocomposite Paste for Electrochemical Migration Resistance    관리자    2013/12/19  2126
67    Reliability Properties of Solderable Conductive Adhesives with Low-Melting-Point Alloy Fillers    관리자    2013/01/10  886
66    Mechanical strength and fracture mode transition of Sn-58Bi epoxy solder joints under high-speed shear test    관리자    2012/01/13  956
65    Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging    관리자    2012/01/13  830
64    Dynamic Filling Characteristic Capillary Driven Underfill Process in Flip-Chip Packaging    관리자    2012/01/13  860
63    Reliability of Fine-Pitch Flip-Chip (COG) Bonding with Non-Conductive Film Using Ultrasonic Energy    관리자    2011/03/09  977
62    Characteristics of Thermosonic Anisotropic Conductive Adhesives (ACFs) Flip-Chip Bonding    관리자    2010/10/22  1054
61    Reliability of Fine-Pitch Flip-Chip (COG) Bonding with Non-Conductive Film Using Ultrasonic Energy    관리자    2010/08/22  979
60    Effect of Surface Treatment on the Mechanical Strength of Ultrasonically Bonded Chip    관리자    2009/08/17  1274
59    Self-Organized Interconnection Process Using Solderable ACA    관리자    2009/07/04  1003
58    Characteristics of Sn-2.5Ag Flip Chip Solder Joints under Thermal Shock Test Conditions    관리자    2009/04/17  1191
57    Finite Element Modeling of Ultrasonic Chip on Glass (COG) Bonding with Anisotropic Conductive Films (ACFs)    관리자    2008/07/28  1219
56    Thermosonic Chip on Glass (COG) Bonding with Anisotropic Conductive Films (ACFs)    관리자    2008/07/28  1055
55    Development of a Visual Monitoring System for Deformation Measuring of Welded Members and its Application    관리자    2008/07/28  971
54    Weldability Studies on the Replacement Repair Welded Joints of a Damaged Steel Bridge    관리자    2008/07/28  866
53    Reliability Assessment of Lead Free Soldered PWBs    관리자    2008/07/28  865
52    Reliability Evaluation of QFP Solder Joint Using Sn-8Zn-3Bi Solder Paste during the Thermal Shock Test    관리자    2008/07/28  834
51    An Investigation on Wetting Characteristics of Solder Particle for Solderable Electrically Conductive Adhesives (ECAs)    관리자    2008/07/28  832
50    A Numerical Study on Nonequilibrium Heat Transfer and Crater Formation in Thin Metal Films Irradiated by Femtosecond Pulse Laser    관리자    2008/07/28  809
49    Interfacial reaction and joint reliability of fine-pitch flip-chip solder bump using stencil printing method    관리자    2007/08/30  1012
48    Reliability Evaluation of QFP Solder Joint Using Sn-8Zn-3Bi Solder Paste during the Thermal Shock Test    관리자    2007/08/30  1279
47    An Investigation on Wetting Characteristics of Solder Particle for Solderable Electrically Conductive Adhesives (ECAs)    관리자    2007/08/30  844
46    Rate-Dependent Hysteresis Model for the Structural Steel(SM490) Considering the Coupled Effect of Strain Rate Hardening and Temperature Rise    관리자    2007/08/30  2030
45    Development of Visual Monitoring System for Deformation Measuring of Welded Members and Its Application    관리자    2007/08/30  722
44    Reliability Assessment of Lead Free Soldered PWBs    관리자    2007/08/30  1698
43    A Numerical Study on Nonequilibrium Heat Transfer and Crater Formation in Thin Metal Films Irradiated by Femtosecond Pulse Laser    관리자    2007/08/30  720
42    The behavior of welded joint in steel pipe members under monotonic and cyclic loading    관리자    2007/04/27  871
41    Three Temperature Model for Nonequilibrium Energy Transfer in Semiconductor Films Irradiated with Short Pulse Lasers    관리자    2007/04/27  894
40    Board-level reliability of Pb-free surface mounted assemblies during thermal shock testing    관리자    2007/04/27  837
39    The Influences of Residual Stress on the Frequence of Ultrasonic Transducers with Composite Membrane Structure    관리자    2007/04/27  878
38     Stress influences on the ultrasonic transducers    관리자    2007/04/27  789
37    Selection of Proper Fatigue Model for Flip Chip Package Reliability    관리자    2007/04/27  878
36    Thermal Fatigue Life of Underfilled μBGA and Flip Chip Solder Joints    관리자    2007/04/27  762
35    Dynamic modeling for resin self-alignment mechanism    관리자    2007/04/27  744
34    Intermatallic Compound Layer Formation Between Sn-3.5Ag BGA Solder Ball and(Cu, immersion Au/electroless Ni-p/Cu)  Substrate    관리자    2007/04/27  765
33    Effect of Viscosity of Liquid Resin on Resin Self-Alignment Capability    관리자    2007/04/27  793
32    Interfacial Reaction between Sn-58mass%Bi Eutectic Solder and (Cu, Electroless Ni-P /Cu) Substrate    관리자    2007/04/27  919
31    A Study on μBGA Solder Joints Reliability Using Lead-free Solder Materials    관리자    2007/04/27  749
30    Effect of Isothermal Aging on Ball Shear Strength on BGA Joints with Sn-3.5Ag-0.75Cu solder    관리자    2007/04/27  804
29    3D High Precise Self-Alignment Process Using Surface Tension of Liquid Resin Material    관리자    2007/04/27  877
28    Reliability and Optimal Shape Prediction of μBGA    관리자    2007/04/27  741
27    Estimate Optimal Shape of μBGA Solder Joints and Thermal Fatigu Life    관리자    2007/04/27  775
26    Underfilled BGAs for Borard Level Reliability    관리자    2007/04/27  813
25    전자디바이스의 최근 실장경향과 접합부의 신뢰성 핵심기술    관리자    2007/04/27  763
24    The Growth Kinetics of Intermetallic Compound Layer at the Interface between Sn-3.5Ag Base Solder and (Cu, Electroless Ni-P/Cu, Immersion Au/Ni-P/Cu) Substrate    관리자    2007/04/27  838
23    Residual Stress in Fillet Welding of Similar or Dissimilar Steels and Stress under Loads    관리자    2007/04/27  766
22    Effects of friction welding parameters on the mechanical and metallurgical properties of type 5052 Al/SS41 joints    관리자    2007/04/27  751
21    Effects of welding speed and aging heat treatment on the friction stir welded joint of Al-Mg-Si aluminum ally    관리자    2007/04/27  758
20    Flip chip bumping by electroless Ni    관리자    2007/04/27  747
19    The study on micro soldering using low-residue flux in soldering joint    관리자    2007/04/27  854
18    Aging Characteristic and prediction of thermal fatigue life of lead-free BGA solder joints    관리자    2007/04/27  709
17    Study on Reliability of Micro BGA Solder Joints with Lead-free solder Materials    관리자    2007/04/27  759
16    A Study on Fluxless Soldering of Si-Wafer/Glass Substrate Using Sn-3.5mass% Ag and Sn-37mass%Pb Solder    관리자    2007/04/27  794
15    The Effect of Bi Concentration on Wettability of Cu Substrate by Sn-Bi Solders    관리자    2007/04/27  833
14    Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis    관리자    2007/04/27  728
13    Effect of Plasma Treatment on the Fluxless Soldering of Si-wafer to Glass Substrate    관리자    2007/04/27  804
12    비납솔더를 사용한 미세피치 솔더접합부의 신뢰성에 대한연구    관리자    2007/04/27  779
11    Analysis of the Wetting Balance Test Part 1: The Effect of Immersion Depth    관리자    2007/04/27  1011
10    Stress Analysis and Life Improvement of Solder Joint in TSOP with Claded Die Pad    관리자    2007/04/27  881
9    이종 전자재료 Joint 부위의 신뢰성에 관한 연구    관리자    2007/04/27  1038
8    저온접합프로세스에 의한 접합부의 품질향상과 그 접합부의 신뢰성    관리자    2007/04/27  1024
7    도금형성프로세스와 열원형태에 의한 접합성에 관한 검토    관리자    2007/04/27  971
6    미세 전자재료의 접합현상과 프로세스 제어    관리자    2007/04/27  1064
5    Joining Phenomena of Different Electronic Meterials in Parallel Gap Resistance Joining Process    관리자    2007/04/27  966
4    Investigation on Optical Thickness of Plating Layers and Reliability of Bonds with Low Temperature Bonding Process    관리자    2007/04/27  875
3    Improvement of the Bond Quality and Effect of Bonding Temperature Lowering by Applying the Inserted Metal of Low Melting Point    관리자    2007/04/26  1141
2    Temperature Rise at Bonding Parts and Bonding Mechanism of Parallel Gap Bonding Method    관리자    2007/04/26  1093
1    Heat Distribution of Bonding Parts and Bonding Factors in Parallel Gap Bonding Method    관리자    2007/04/26  822
1
Copyright 1999-2018 Zeroboard / skin by kidd^^