▒▒▒ Micro materials & joining Laboratory ▒▒


 78, 1/1 회원가입  로그인  
78    Ball Grid Array Interconnection Properties of Solderable Polymer–Solder Composites With Low-Melting-Point Alloy Fillers    관리자    2017/12/07  153
77    Comparison of the 60Sn40Pb and 62Sn2Ag36Pb Solders for a PV Ribbon Joint in Photovoltaic Modules Using the Thermal Shock Test    관리자    2017/04/21  1412
76    Degradation Characteristics and Ni3Sn4 IMC Growth by a Thermal Shock Test in SAC305 Solder Joints of MLCCs Applied in Automotive Electronics    관리자    2016/04/03  1824
75    Evaluation of the Characteristics of 305SAC Lead-Free Solder Joints between a Chip Electrode and a Cu-Pad in Automotive Electronics    관리자    2015/11/06  666
74    Research on the Power Drop of Photovoltaic Module’s Aging Through the Thermal Shock Test    관리자    2015/11/06  646
73    Fabrication of SiCp/2024 Composite Alloys Using Friction Stir Welding and Its Mechanical Properties    관리자    2015/07/20  818
72    Bonding Characteristics of Underfilled Ball Grid Array Packaging    관리자    2015/07/14  718
71    An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler    관리자    2015/01/12  634
70    Dynamic behavior of capillary-driven encapsulation flow characteristics for different injection types in flip chip packaging    관리자    2014/02/21  803
69    Study of Characteristics of Solar Cells through Thermal Shock and High-Temperature and High-Humidity Testing    관리자    2014/02/14  786
68    Characterization of Ag-Pd Nanocomposite Paste for Electrochemical Migration Resistance    관리자    2013/12/19  2168
67    Reliability Properties of Solderable Conductive Adhesives with Low-Melting-Point Alloy Fillers    관리자    2013/01/10  900
66    Mechanical strength and fracture mode transition of Sn-58Bi epoxy solder joints under high-speed shear test    관리자    2012/01/13  962
65    Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging    관리자    2012/01/13  838
64    Dynamic Filling Characteristic Capillary Driven Underfill Process in Flip-Chip Packaging    관리자    2012/01/13  865
63    Reliability of Fine-Pitch Flip-Chip (COG) Bonding with Non-Conductive Film Using Ultrasonic Energy    관리자    2011/03/09  980
62    Characteristics of Thermosonic Anisotropic Conductive Adhesives (ACFs) Flip-Chip Bonding    관리자    2010/10/22  1058
61    Reliability of Fine-Pitch Flip-Chip (COG) Bonding with Non-Conductive Film Using Ultrasonic Energy    관리자    2010/08/22  982
60    Effect of Surface Treatment on the Mechanical Strength of Ultrasonically Bonded Chip    관리자    2009/08/17  1279
59    Self-Organized Interconnection Process Using Solderable ACA    관리자    2009/07/04  1005
58    Characteristics of Sn-2.5Ag Flip Chip Solder Joints under Thermal Shock Test Conditions    관리자    2009/04/17  1193
57    Finite Element Modeling of Ultrasonic Chip on Glass (COG) Bonding with Anisotropic Conductive Films (ACFs)    관리자    2008/07/28  1223
56    Thermosonic Chip on Glass (COG) Bonding with Anisotropic Conductive Films (ACFs)    관리자    2008/07/28  1058
55    Development of a Visual Monitoring System for Deformation Measuring of Welded Members and its Application    관리자    2008/07/28  973
54    Weldability Studies on the Replacement Repair Welded Joints of a Damaged Steel Bridge    관리자    2008/07/28  868
53    Reliability Assessment of Lead Free Soldered PWBs    관리자    2008/07/28  867
52    Reliability Evaluation of QFP Solder Joint Using Sn-8Zn-3Bi Solder Paste during the Thermal Shock Test    관리자    2008/07/28  836
51    An Investigation on Wetting Characteristics of Solder Particle for Solderable Electrically Conductive Adhesives (ECAs)    관리자    2008/07/28  834
50    A Numerical Study on Nonequilibrium Heat Transfer and Crater Formation in Thin Metal Films Irradiated by Femtosecond Pulse Laser    관리자    2008/07/28  811
49    Interfacial reaction and joint reliability of fine-pitch flip-chip solder bump using stencil printing method    관리자    2007/08/30  1014
48    Reliability Evaluation of QFP Solder Joint Using Sn-8Zn-3Bi Solder Paste during the Thermal Shock Test    관리자    2007/08/30  1282
47    An Investigation on Wetting Characteristics of Solder Particle for Solderable Electrically Conductive Adhesives (ECAs)    관리자    2007/08/30  846
46    Rate-Dependent Hysteresis Model for the Structural Steel(SM490) Considering the Coupled Effect of Strain Rate Hardening and Temperature Rise    관리자    2007/08/30  2033
45    Development of Visual Monitoring System for Deformation Measuring of Welded Members and Its Application    관리자    2007/08/30  724
44    Reliability Assessment of Lead Free Soldered PWBs    관리자    2007/08/30  1700
43    A Numerical Study on Nonequilibrium Heat Transfer and Crater Formation in Thin Metal Films Irradiated by Femtosecond Pulse Laser    관리자    2007/08/30  870
42    The behavior of welded joint in steel pipe members under monotonic and cyclic loading    관리자    2007/04/27  889
41    Three Temperature Model for Nonequilibrium Energy Transfer in Semiconductor Films Irradiated with Short Pulse Lasers    관리자    2007/04/27  942
40    Board-level reliability of Pb-free surface mounted assemblies during thermal shock testing    관리자    2007/04/27  839
39    The Influences of Residual Stress on the Frequence of Ultrasonic Transducers with Composite Membrane Structure    관리자    2007/04/27  880
38     Stress influences on the ultrasonic transducers    관리자    2007/04/27  791
37    Selection of Proper Fatigue Model for Flip Chip Package Reliability    관리자    2007/04/27  880
36    Thermal Fatigue Life of Underfilled μBGA and Flip Chip Solder Joints    관리자    2007/04/27  764
35    Dynamic modeling for resin self-alignment mechanism    관리자    2007/04/27  747
34    Intermatallic Compound Layer Formation Between Sn-3.5Ag BGA Solder Ball and(Cu, immersion Au/electroless Ni-p/Cu)  Substrate    관리자    2007/04/27  766
33    Effect of Viscosity of Liquid Resin on Resin Self-Alignment Capability    관리자    2007/04/27  795
32    Interfacial Reaction between Sn-58mass%Bi Eutectic Solder and (Cu, Electroless Ni-P /Cu) Substrate    관리자    2007/04/27  921
31    A Study on μBGA Solder Joints Reliability Using Lead-free Solder Materials    관리자    2007/04/27  751
30    Effect of Isothermal Aging on Ball Shear Strength on BGA Joints with Sn-3.5Ag-0.75Cu solder    관리자    2007/04/27  806
29    3D High Precise Self-Alignment Process Using Surface Tension of Liquid Resin Material    관리자    2007/04/27  881
28    Reliability and Optimal Shape Prediction of μBGA    관리자    2007/04/27  743
27    Estimate Optimal Shape of μBGA Solder Joints and Thermal Fatigu Life    관리자    2007/04/27  777
26    Underfilled BGAs for Borard Level Reliability    관리자    2007/04/27  816
25    전자디바이스의 최근 실장경향과 접합부의 신뢰성 핵심기술    관리자    2007/04/27  767
24    The Growth Kinetics of Intermetallic Compound Layer at the Interface between Sn-3.5Ag Base Solder and (Cu, Electroless Ni-P/Cu, Immersion Au/Ni-P/Cu) Substrate    관리자    2007/04/27  841
23    Residual Stress in Fillet Welding of Similar or Dissimilar Steels and Stress under Loads    관리자    2007/04/27  767
22    Effects of friction welding parameters on the mechanical and metallurgical properties of type 5052 Al/SS41 joints    관리자    2007/04/27  754
21    Effects of welding speed and aging heat treatment on the friction stir welded joint of Al-Mg-Si aluminum ally    관리자    2007/04/27  760
20    Flip chip bumping by electroless Ni    관리자    2007/04/27  748
19    The study on micro soldering using low-residue flux in soldering joint    관리자    2007/04/27  856
18    Aging Characteristic and prediction of thermal fatigue life of lead-free BGA solder joints    관리자    2007/04/27  850
17    Study on Reliability of Micro BGA Solder Joints with Lead-free solder Materials    관리자    2007/04/27  760
16    A Study on Fluxless Soldering of Si-Wafer/Glass Substrate Using Sn-3.5mass% Ag and Sn-37mass%Pb Solder    관리자    2007/04/27  798
15    The Effect of Bi Concentration on Wettability of Cu Substrate by Sn-Bi Solders    관리자    2007/04/27  835
14    Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis    관리자    2007/04/27  731
13    Effect of Plasma Treatment on the Fluxless Soldering of Si-wafer to Glass Substrate    관리자    2007/04/27  806
12    비납솔더를 사용한 미세피치 솔더접합부의 신뢰성에 대한연구    관리자    2007/04/27  781
11    Analysis of the Wetting Balance Test Part 1: The Effect of Immersion Depth    관리자    2007/04/27  1013
10    Stress Analysis and Life Improvement of Solder Joint in TSOP with Claded Die Pad    관리자    2007/04/27  884
9    이종 전자재료 Joint 부위의 신뢰성에 관한 연구    관리자    2007/04/27  1043
8    저온접합프로세스에 의한 접합부의 품질향상과 그 접합부의 신뢰성    관리자    2007/04/27  1027
7    도금형성프로세스와 열원형태에 의한 접합성에 관한 검토    관리자    2007/04/27  974
6    미세 전자재료의 접합현상과 프로세스 제어    관리자    2007/04/27  1069
5    Joining Phenomena of Different Electronic Meterials in Parallel Gap Resistance Joining Process    관리자    2007/04/27  971
4    Investigation on Optical Thickness of Plating Layers and Reliability of Bonds with Low Temperature Bonding Process    관리자    2007/04/27  878
3    Improvement of the Bond Quality and Effect of Bonding Temperature Lowering by Applying the Inserted Metal of Low Melting Point    관리자    2007/04/26  1144
2    Temperature Rise at Bonding Parts and Bonding Mechanism of Parallel Gap Bonding Method    관리자    2007/04/26  1155
1    Heat Distribution of Bonding Parts and Bonding Factors in Parallel Gap Bonding Method    관리자    2007/04/26  826
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