¢Æ¢Æ¢Æ Micro materials & joining Laboratory ¢Æ¢Æ
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83,
1/1
83
Bonding Strengths and Thermal Degradation of Photovoltaic Module Ribbon Solder Joints
°ü¸®ÀÚ
2019/04/30
1402
82
Growth of an Ag3Sn Intermetallic Compound Layer Within Photovoltaic Module Ribbon Solder Joints
°ü¸®ÀÚ
2019/04/30
1294
81
The Effect of Epoxy Polymer Addition in Sn-Ag-Cu and Sn-Bi Solder Joints
°ü¸®ÀÚ
2019/03/28
1561
80
Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn–Ag–Cu Solder on a Cu Substrate
°ü¸®ÀÚ
2019/03/28
1254
79
Influence of multi-walled carbon nanotube (MWCNT) concentration on the thermo-mechanical reliability properties of solderable anisotropic conductive adhesives (SACAs)
°ü¸®ÀÚ
2018/11/01
951
78
Ball Grid Array Interconnection Properties of Solderable Polymer–Solder Composites With Low-Melting-Point Alloy Fillers
°ü¸®ÀÚ
2017/12/07
3118
77
Comparison of the 60Sn40Pb and 62Sn2Ag36Pb Solders for a PV Ribbon Joint in Photovoltaic Modules Using the Thermal Shock Test
°ü¸®ÀÚ
2017/04/21
2748
76
Degradation Characteristics and Ni3Sn4 IMC Growth by a Thermal Shock Test in SAC305 Solder Joints of MLCCs Applied in Automotive Electronics
°ü¸®ÀÚ
2016/04/03
2936
75
Evaluation of the Characteristics of 305SAC Lead-Free Solder Joints between a Chip Electrode and a Cu-Pad in Automotive Electronics
°ü¸®ÀÚ
2015/11/06
1705
74
Research on the Power Drop of Photovoltaic Module¡¯s Aging Through the Thermal Shock Test
°ü¸®ÀÚ
2015/11/06
1594
73
Fabrication of SiCp/2024 Composite Alloys Using Friction Stir Welding and Its Mechanical Properties
°ü¸®ÀÚ
2015/07/20
1773
72
Bonding Characteristics of Underfilled Ball Grid Array Packaging
°ü¸®ÀÚ
2015/07/14
1611
71
An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler
°ü¸®ÀÚ
2015/01/12
1515
70
Dynamic behavior of capillary-driven encapsulation flow characteristics for different injection types in flip chip packaging
°ü¸®ÀÚ
2014/02/21
2116
69
Study of Characteristics of Solar Cells through Thermal Shock and High-Temperature and High-Humidity Testing
°ü¸®ÀÚ
2014/02/14
1837
68
Characterization of Ag-Pd Nanocomposite Paste for Electrochemical Migration Resistance
°ü¸®ÀÚ
2013/12/19
3676
67
Reliability Properties of Solderable Conductive Adhesives with Low-Melting-Point Alloy Fillers
°ü¸®ÀÚ
2013/01/10
1741
66
Mechanical strength and fracture mode transition of Sn-58Bi epoxy solder joints under high-speed shear test
°ü¸®ÀÚ
2012/01/13
1798
65
Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging
°ü¸®ÀÚ
2012/01/13
1907
64
Dynamic Filling Characteristic Capillary Driven Underfill Process in Flip-Chip Packaging
°ü¸®ÀÚ
2012/01/13
1703
63
Reliability of Fine-Pitch Flip-Chip (COG) Bonding with Non-Conductive Film Using Ultrasonic Energy
°ü¸®ÀÚ
2011/03/09
1826
62
Characteristics of Thermosonic Anisotropic Conductive Adhesives (ACFs) Flip-Chip Bonding
°ü¸®ÀÚ
2010/10/22
1884
61
Reliability of Fine-Pitch Flip-Chip (COG) Bonding with Non-Conductive Film Using Ultrasonic Energy
°ü¸®ÀÚ
2010/08/22
1800
60
Effect of Surface Treatment on the Mechanical Strength of Ultrasonically Bonded Chip
°ü¸®ÀÚ
2009/08/17
2090
59
Self-Organized Interconnection Process Using Solderable ACA
°ü¸®ÀÚ
2009/07/04
1832
58
Characteristics of Sn-2.5Ag Flip Chip Solder Joints under Thermal Shock Test Conditions
°ü¸®ÀÚ
2009/04/17
2022
57
Finite Element Modeling of Ultrasonic Chip on Glass (COG) Bonding with Anisotropic Conductive Films (ACFs)
°ü¸®ÀÚ
2008/07/28
2074
56
Thermosonic Chip on Glass (COG) Bonding with Anisotropic Conductive Films (ACFs)
°ü¸®ÀÚ
2008/07/28
1878
55
Development of a Visual Monitoring System for Deformation Measuring of Welded Members and its Application
°ü¸®ÀÚ
2008/07/28
1792
54
Weldability Studies on the Replacement Repair Welded Joints of a Damaged Steel Bridge
°ü¸®ÀÚ
2008/07/28
1685
53
Reliability Assessment of Lead Free Soldered PWBs
°ü¸®ÀÚ
2008/07/28
2074
52
Reliability Evaluation of QFP Solder Joint Using Sn-8Zn-3Bi Solder Paste during the Thermal Shock Test
°ü¸®ÀÚ
2008/07/28
1678
51
An Investigation on Wetting Characteristics of Solder Particle for Solderable Electrically Conductive Adhesives (ECAs)
°ü¸®ÀÚ
2008/07/28
1637
50
A Numerical Study on Nonequilibrium Heat Transfer and Crater Formation in Thin Metal Films Irradiated by Femtosecond Pulse Laser
°ü¸®ÀÚ
2008/07/28
1633
49
Interfacial reaction and joint reliability of fine-pitch flip-chip solder bump using stencil printing method
°ü¸®ÀÚ
2007/08/30
1918
48
Reliability Evaluation of QFP Solder Joint Using Sn-8Zn-3Bi Solder Paste during the Thermal Shock Test
°ü¸®ÀÚ
2007/08/30
2095
47
An Investigation on Wetting Characteristics of Solder Particle for Solderable Electrically Conductive Adhesives (ECAs)
°ü¸®ÀÚ
2007/08/30
1657
46
Rate-Dependent Hysteresis Model for the Structural Steel(SM490) Considering the Coupled Effect of Strain Rate Hardening and Temperature Rise
°ü¸®ÀÚ
2007/08/30
2930
45
Development of Visual Monitoring System for Deformation Measuring of Welded Members and Its Application
°ü¸®ÀÚ
2007/08/30
1535
44
Reliability Assessment of Lead Free Soldered PWBs
°ü¸®ÀÚ
2007/08/30
2537
43
A Numerical Study on Nonequilibrium Heat Transfer and Crater Formation in Thin Metal Films Irradiated by Femtosecond Pulse Laser
°ü¸®ÀÚ
2007/08/30
1712
42
The behavior of welded joint in steel pipe members under monotonic and cyclic loading
°ü¸®ÀÚ
2007/04/27
1749
41
Three Temperature Model for Nonequilibrium Energy Transfer in Semiconductor Films Irradiated with Short Pulse Lasers
°ü¸®ÀÚ
2007/04/27
1792
40
Board-level reliability of Pb-free surface mounted assemblies during thermal shock testing
°ü¸®ÀÚ
2007/04/27
1697
39
The Influences of Residual Stress on the Frequence of Ultrasonic Transducers with Composite Membrane Structure
°ü¸®ÀÚ
2007/04/27
1729
38
Stress influences on the ultrasonic transducers
°ü¸®ÀÚ
2007/04/27
1638
37
Selection of Proper Fatigue Model for Flip Chip Package Reliability
°ü¸®ÀÚ
2007/04/27
1735
36
Thermal Fatigue Life of Underfilled ¥ìBGA and Flip Chip Solder Joints
°ü¸®ÀÚ
2007/04/27
1600
35
Dynamic modeling for resin self-alignment mechanism
°ü¸®ÀÚ
2007/04/27
1566
34
Intermatallic Compound Layer Formation Between Sn-3.5Ag BGA Solder Ball and(Cu, immersion Au/electroless Ni-p/Cu) Substrate
°ü¸®ÀÚ
2007/04/27
1634
33
Effect of Viscosity of Liquid Resin on Resin Self-Alignment Capability
°ü¸®ÀÚ
2007/04/27
1685
32
Interfacial Reaction between Sn-58mass%Bi Eutectic Solder and (Cu, Electroless Ni-P /Cu) Substrate
°ü¸®ÀÚ
2007/04/27
1810
31
A Study on ¥ìBGA Solder Joints Reliability Using Lead-free Solder Materials
°ü¸®ÀÚ
2007/04/27
1631
30
Effect of Isothermal Aging on Ball Shear Strength on BGA Joints with Sn-3.5Ag-0.75Cu solder
°ü¸®ÀÚ
2007/04/27
1678
29
3D High Precise Self-Alignment Process Using Surface Tension of Liquid Resin Material
°ü¸®ÀÚ
2007/04/27
2004
28
Reliability and Optimal Shape Prediction of ¥ìBGA
°ü¸®ÀÚ
2007/04/27
4280
27
Estimate Optimal Shape of ¥ìBGA Solder Joints and Thermal Fatigu Life
°ü¸®ÀÚ
2007/04/27
1653
26
Underfilled BGAs for Borard Level Reliability
°ü¸®ÀÚ
2007/04/27
1722
25
ÀüÀÚµð¹ÙÀ̽ºÀÇ ÃÖ±Ù ½ÇÀå°æÇâ°ú Á¢ÇÕºÎÀÇ ½Å·Ú¼º Çٽɱâ¼ú
°ü¸®ÀÚ
2007/04/27
1624
24
The Growth Kinetics of Intermetallic Compound Layer at the Interface between Sn-3.5Ag Base Solder and (Cu, Electroless Ni-P/Cu, Immersion Au/Ni-P/Cu) Substrate
°ü¸®ÀÚ
2007/04/27
1685
23
Residual Stress in Fillet Welding of Similar or Dissimilar Steels and Stress under Loads
°ü¸®ÀÚ
2007/04/27
1599
22
Effects of friction welding parameters on the mechanical and metallurgical properties of type 5052 Al/SS41 joints
°ü¸®ÀÚ
2007/04/27
1611
21
Effects of welding speed and aging heat treatment on the friction stir welded joint of Al-Mg-Si aluminum ally
°ü¸®ÀÚ
2007/04/27
1603
20
Flip chip bumping by electroless Ni
°ü¸®ÀÚ
2007/04/27
1702
19
The study on micro soldering using low-residue flux in soldering joint
°ü¸®ÀÚ
2007/04/27
1941
18
Aging Characteristic and prediction of thermal fatigue life of lead-free BGA solder joints
°ü¸®ÀÚ
2007/04/27
2058
17
Study on Reliability of Micro BGA Solder Joints with Lead-free solder Materials
°ü¸®ÀÚ
2007/04/27
1636
16
A Study on Fluxless Soldering of Si-Wafer/Glass Substrate Using Sn-3.5mass% Ag and Sn-37mass%Pb Solder
°ü¸®ÀÚ
2007/04/27
1749
15
The Effect of Bi Concentration on Wettability of Cu Substrate by Sn-Bi Solders
°ü¸®ÀÚ
2007/04/27
1753
14
Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis
°ü¸®ÀÚ
2007/04/27
1627
13
Effect of Plasma Treatment on the Fluxless Soldering of Si-wafer to Glass Substrate
°ü¸®ÀÚ
2007/04/27
1702
12
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°ü¸®ÀÚ
2007/04/27
1717
11
Analysis of the Wetting Balance Test Part 1: The Effect of Immersion Depth
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2007/04/27
1948
10
Stress Analysis and Life Improvement of Solder Joint in TSOP with Claded Die Pad
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2007/04/27
1823
9
ÀÌÁ¾ ÀüÀÚÀç·á Joint ºÎÀ§ÀÇ ½Å·Ú¼º¿¡ °üÇÑ ¿¬±¸
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2007/04/27
1979
8
Àú¿ÂÁ¢ÇÕÇÁ·Î¼¼½º¿¡ ÀÇÇÑ Á¢ÇÕºÎÀÇ Ç°ÁúÇâ»ó°ú ±× Á¢ÇÕºÎÀÇ ½Å·Ú¼º
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2007/04/27
1914
7
µµ±ÝÇü¼ºÇÁ·Î¼¼½º¿Í ¿¿øÇüÅ¿¡ ÀÇÇÑ Á¢ÇÕ¼º¿¡ °üÇÑ °ËÅä
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2007/04/27
1885
6
¹Ì¼¼ ÀüÀÚÀç·áÀÇ Á¢ÇÕÇö»ó°ú ÇÁ·Î¼¼½º Á¦¾î
°ü¸®ÀÚ
2007/04/27
2089
5
Joining Phenomena of Different Electronic Meterials in Parallel Gap Resistance Joining Process
°ü¸®ÀÚ
2007/04/27
2272
4
Investigation on Optical Thickness of Plating Layers and Reliability of Bonds with Low Temperature Bonding Process
°ü¸®ÀÚ
2007/04/27
1726
3
Improvement of the Bond Quality and Effect of Bonding Temperature Lowering by Applying the Inserted Metal of Low Melting Point
°ü¸®ÀÚ
2007/04/26
2086
2
Temperature Rise at Bonding Parts and Bonding Mechanism of Parallel Gap Bonding Method
°ü¸®ÀÚ
2007/04/26
2315
1
Heat Distribution of Bonding Parts and Bonding Factors in Parallel Gap Bonding Method
°ü¸®ÀÚ
2007/04/26
1820
1
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