¢Æ¢Æ¢Æ Micro materials & joining Laboratory ¢Æ¢Æ
79,
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79
Heat Distribution of Bonding Parts and Bonding Factors in Parallel Gap Bonding Method
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2007/04/26
837
78
Temperature Rise at Bonding Parts and Bonding Mechanism of Parallel Gap Bonding Method
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2007/04/26
1228
77
Improvement of the Bond Quality and Effect of Bonding Temperature Lowering by Applying the Inserted Metal of Low Melting Point
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2007/04/26
1163
76
Investigation on Optical Thickness of Plating Layers and Reliability of Bonds with Low Temperature Bonding Process
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2007/04/27
895
75
Joining Phenomena of Different Electronic Meterials in Parallel Gap Resistance Joining Process
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2007/04/27
1032
74
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2007/04/27
1094
73
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2007/04/27
988
72
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2007/04/27
1034
71
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2007/04/27
1064
70
Stress Analysis and Life Improvement of Solder Joint in TSOP with Claded Die Pad
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2007/04/27
900
69
Analysis of the Wetting Balance Test Part 1: The Effect of Immersion Depth
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2007/04/27
1029
68
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2007/04/27
792
67
Effect of Plasma Treatment on the Fluxless Soldering of Si-wafer to Glass Substrate
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2007/04/27
814
66
Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis
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2007/04/27
743
65
The Effect of Bi Concentration on Wettability of Cu Substrate by Sn-Bi Solders
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2007/04/27
846
64
A Study on Fluxless Soldering of Si-Wafer/Glass Substrate Using Sn-3.5mass% Ag and Sn-37mass%Pb Solder
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2007/04/27
812
63
Study on Reliability of Micro BGA Solder Joints with Lead-free solder Materials
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2007/04/27
777
62
Aging Characteristic and prediction of thermal fatigue life of lead-free BGA solder joints
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2007/04/27
862
61
The study on micro soldering using low-residue flux in soldering joint
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2007/04/27
885
60
Flip chip bumping by electroless Ni
°ü¸®ÀÚ
2007/04/27
758
59
Effects of welding speed and aging heat treatment on the friction stir welded joint of Al-Mg-Si aluminum ally
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2007/04/27
771
58
Effects of friction welding parameters on the mechanical and metallurgical properties of type 5052 Al/SS41 joints
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2007/04/27
769
57
Residual Stress in Fillet Welding of Similar or Dissimilar Steels and Stress under Loads
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2007/04/27
779
56
The Growth Kinetics of Intermetallic Compound Layer at the Interface between Sn-3.5Ag Base Solder and (Cu, Electroless Ni-P/Cu, Immersion Au/Ni-P/Cu) Substrate
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2007/04/27
851
55
ÀüÀÚµð¹ÙÀ̽ºÀÇ ÃÖ±Ù ½ÇÀå°æÇâ°ú Á¢ÇÕºÎÀÇ ½Å·Ú¼º Çٽɱâ¼ú
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2007/04/27
778
54
Underfilled BGAs for Borard Level Reliability
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2007/04/27
829
53
Estimate Optimal Shape of ¥ìBGA Solder Joints and Thermal Fatigu Life
°ü¸®ÀÚ
2007/04/27
789
52
Reliability and Optimal Shape Prediction of ¥ìBGA
°ü¸®ÀÚ
2007/04/27
755
51
3D High Precise Self-Alignment Process Using Surface Tension of Liquid Resin Material
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2007/04/27
896
50
Effect of Isothermal Aging on Ball Shear Strength on BGA Joints with Sn-3.5Ag-0.75Cu solder
°ü¸®ÀÚ
2007/04/27
820
49
A Study on ¥ìBGA Solder Joints Reliability Using Lead-free Solder Materials
°ü¸®ÀÚ
2007/04/27
763
48
Interfacial Reaction between Sn-58mass%Bi Eutectic Solder and (Cu, Electroless Ni-P /Cu) Substrate
°ü¸®ÀÚ
2007/04/27
933
47
Effect of Viscosity of Liquid Resin on Resin Self-Alignment Capability
°ü¸®ÀÚ
2007/04/27
813
46
Intermatallic Compound Layer Formation Between Sn-3.5Ag BGA Solder Ball and(Cu, immersion Au/electroless Ni-p/Cu) Substrate
°ü¸®ÀÚ
2007/04/27
777
45
Dynamic modeling for resin self-alignment mechanism
°ü¸®ÀÚ
2007/04/27
757
44
Thermal Fatigue Life of Underfilled ¥ìBGA and Flip Chip Solder Joints
°ü¸®ÀÚ
2007/04/27
775
43
Selection of Proper Fatigue Model for Flip Chip Package Reliability
°ü¸®ÀÚ
2007/04/27
894
42
Stress influences on the ultrasonic transducers
°ü¸®ÀÚ
2007/04/27
806
41
The Influences of Residual Stress on the Frequence of Ultrasonic Transducers with Composite Membrane Structure
°ü¸®ÀÚ
2007/04/27
895
40
Board-level reliability of Pb-free surface mounted assemblies during thermal shock testing
°ü¸®ÀÚ
2007/04/27
855
39
Three Temperature Model for Nonequilibrium Energy Transfer in Semiconductor Films Irradiated with Short Pulse Lasers
°ü¸®ÀÚ
2007/04/27
951
38
The behavior of welded joint in steel pipe members under monotonic and cyclic loading
°ü¸®ÀÚ
2007/04/27
902
37
A Numerical Study on Nonequilibrium Heat Transfer and Crater Formation in Thin Metal Films Irradiated by Femtosecond Pulse Laser
°ü¸®ÀÚ
2007/08/30
888
36
Reliability Assessment of Lead Free Soldered PWBs
°ü¸®ÀÚ
2007/08/30
1711
35
Development of Visual Monitoring System for Deformation Measuring of Welded Members and Its Application
°ü¸®ÀÚ
2007/08/30
735
34
Rate-Dependent Hysteresis Model for the Structural Steel(SM490) Considering the Coupled Effect of Strain Rate Hardening and Temperature Rise
°ü¸®ÀÚ
2007/08/30
2043
33
An Investigation on Wetting Characteristics of Solder Particle for Solderable Electrically Conductive Adhesives (ECAs)
°ü¸®ÀÚ
2007/08/30
857
32
Reliability Evaluation of QFP Solder Joint Using Sn-8Zn-3Bi Solder Paste during the Thermal Shock Test
°ü¸®ÀÚ
2007/08/30
1294
31
Interfacial reaction and joint reliability of fine-pitch flip-chip solder bump using stencil printing method
°ü¸®ÀÚ
2007/08/30
1037
30
A Numerical Study on Nonequilibrium Heat Transfer and Crater Formation in Thin Metal Films Irradiated by Femtosecond Pulse Laser
°ü¸®ÀÚ
2008/07/28
820
29
An Investigation on Wetting Characteristics of Solder Particle for Solderable Electrically Conductive Adhesives (ECAs)
°ü¸®ÀÚ
2008/07/28
846
28
Reliability Evaluation of QFP Solder Joint Using Sn-8Zn-3Bi Solder Paste during the Thermal Shock Test
°ü¸®ÀÚ
2008/07/28
847
27
Reliability Assessment of Lead Free Soldered PWBs
°ü¸®ÀÚ
2008/07/28
878
26
Weldability Studies on the Replacement Repair Welded Joints of a Damaged Steel Bridge
°ü¸®ÀÚ
2008/07/28
877
25
Development of a Visual Monitoring System for Deformation Measuring of Welded Members and its Application
°ü¸®ÀÚ
2008/07/28
985
24
Thermosonic Chip on Glass (COG) Bonding with Anisotropic Conductive Films (ACFs)
°ü¸®ÀÚ
2008/07/28
1076
23
Finite Element Modeling of Ultrasonic Chip on Glass (COG) Bonding with Anisotropic Conductive Films (ACFs)
°ü¸®ÀÚ
2008/07/28
1238
22
Characteristics of Sn-2.5Ag Flip Chip Solder Joints under Thermal Shock Test Conditions
°ü¸®ÀÚ
2009/04/17
1204
21
Self-Organized Interconnection Process Using Solderable ACA
°ü¸®ÀÚ
2009/07/04
1021
20
Effect of Surface Treatment on the Mechanical Strength of Ultrasonically Bonded Chip
°ü¸®ÀÚ
2009/08/17
1296
19
Reliability of Fine-Pitch Flip-Chip (COG) Bonding with Non-Conductive Film Using Ultrasonic Energy
°ü¸®ÀÚ
2010/08/22
994
18
Characteristics of Thermosonic Anisotropic Conductive Adhesives (ACFs) Flip-Chip Bonding
°ü¸®ÀÚ
2010/10/22
1070
17
Reliability of Fine-Pitch Flip-Chip (COG) Bonding with Non-Conductive Film Using Ultrasonic Energy
°ü¸®ÀÚ
2011/03/09
1015
16
Dynamic Filling Characteristic Capillary Driven Underfill Process in Flip-Chip Packaging
°ü¸®ÀÚ
2012/01/13
879
15
Characteristics of solderable electrically conductive adhesives (ECAs) for electronic packaging
°ü¸®ÀÚ
2012/01/13
866
14
Mechanical strength and fracture mode transition of Sn-58Bi epoxy solder joints under high-speed shear test
°ü¸®ÀÚ
2012/01/13
977
13
Reliability Properties of Solderable Conductive Adhesives with Low-Melting-Point Alloy Fillers
°ü¸®ÀÚ
2013/01/10
928
12
Characterization of Ag-Pd Nanocomposite Paste for Electrochemical Migration Resistance
°ü¸®ÀÚ
2013/12/19
2653
11
Study of Characteristics of Solar Cells through Thermal Shock and High-Temperature and High-Humidity Testing
°ü¸®ÀÚ
2014/02/14
813
10
Dynamic behavior of capillary-driven encapsulation flow characteristics for different injection types in flip chip packaging
°ü¸®ÀÚ
2014/02/21
835
9
An investigation of the reliability of solderable ICA with low-melting-point alloy (LMPA) filler
°ü¸®ÀÚ
2015/01/12
652
8
Bonding Characteristics of Underfilled Ball Grid Array Packaging
°ü¸®ÀÚ
2015/07/14
736
7
Fabrication of SiCp/2024 Composite Alloys Using Friction Stir Welding and Its Mechanical Properties
°ü¸®ÀÚ
2015/07/20
855
6
Research on the Power Drop of Photovoltaic Module¡¯s Aging Through the Thermal Shock Test
°ü¸®ÀÚ
2015/11/06
676
5
Evaluation of the Characteristics of 305SAC Lead-Free Solder Joints between a Chip Electrode and a Cu-Pad in Automotive Electronics
°ü¸®ÀÚ
2015/11/06
698
4
Degradation Characteristics and Ni3Sn4 IMC Growth by a Thermal Shock Test in SAC305 Solder Joints of MLCCs Applied in Automotive Electronics
°ü¸®ÀÚ
2016/04/03
1873
3
Comparison of the 60Sn40Pb and 62Sn2Ag36Pb Solders for a PV Ribbon Joint in Photovoltaic Modules Using the Thermal Shock Test
°ü¸®ÀÚ
2017/04/21
1533
2
Ball Grid Array Interconnection Properties of Solderable Polymer–Solder Composites With Low-Melting-Point Alloy Fillers
°ü¸®ÀÚ
2017/12/07
213
1
Influence of multi-walled carbon nanotube (MWCNT) concentration on the thermo-mechanical reliability properties of solderable anisotropic conductive adhesives (SACAs)
°ü¸®ÀÚ
2018/11/01
73
1
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